Students of Computer Engineering Department present the 3D packaging analysis and design practice system based on IoT research in I-SEEC 2019

20-23/11/2019  Ms.Jurirat Lomloy, Mr.Teekayu Samanmitr, and Ms.Nurainee Dueraaor. They are student from Department of Computer Engineering with Mr.Sethakarn Prongnuch (Head of Computer Engineering Department) and Ms.Patinya Sang-aroon (Head of Printing Design Department) that presents the research topic about the “3D packaging analysis and design practice system based on IoT” in the 10th International Science, Social Science, Engineering and Energy Conference (I-SEEC 2019) at Rajamangala University of Technology Isan Sakon Nakhon Campus, Sakon Nakhon Province, Thailand.